✉news TechnologySemiconductors first seen 1 d ago, last 1 d ago, peak #24
Intel Reports EMIB Wafer Utilization Above 90% Amid AI Chip Demand
Original: Intel Says EMIB Wafer Utilization Tops 90% as AI Chips Drive 70-Bridge Era
Intel says utilization of its EMIB advanced packaging wafers has surpassed 90%, as growing AI accelerator demand pushes designs toward a 70-bridge interconnect era. The company is touting high capacity usage of its packaging technology as a sign that complex, high-bandwidth AI chips are increasingly relying on its embedded multi-die interconnect bridge approach for chiplet-based products.
Why now: AI chip demand is driving attention to advanced packaging capacity and Intel's chiplet interconnect technology.
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