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- 1Intel Reports EMIB Wafer Utilization Above 90% Amid AI Chip Demand▼Intel Says EMIB Wafer Utilization Tops 90% as AI Chips Drive 70-Bridge Era
Intel says utilization of its EMIB advanced packaging wafers has surpassed 90%, as growing AI accelerator demand pushes designs toward a 70-bridge interconnect era. The company is touting high capacity usage of its packaging technology as a sign that complex, high-bandwidth AI chips are increasingly relying on its embedded multi-die interconnect bridge approach for chiplet-based products.