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Samsung chairman tours Yokohama lab to explore AI chip packaging

Original: Samsung chairman Lee Jae-yong visited the Advanced Package Lab in Yokohama on November 1 to explore AI chip packaging. S

Samsung chairman Lee Jae-yong visited the Advanced Package Lab in Yokohama on November 1, examining advanced chip packaging technology as Samsung pushes deeper into AI chip production. The visit is being reported by DigiTimes Asia, which also notes interest in packaging materials, a critical and competitive part of the AI semiconductor supply chain where rivals including SK Hynix are active.

Why now: Samsung's push into AI chip packaging and Japan's key role in semiconductor materials draws attention amid intense AI hardware competition

SamsungLee Jae-yongAdvanced Package Lab YokohamaDigiTimes Asia

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• Samsung chairman Lee Jae-yong visited the Advanced Package Lab in Yokohama on November 1 to explore AI chip packaging. Source: DigiTimes Asia https://www. digitimes.com/news/a20261102VL 212/samsung-chairman-japan-ai-chip-packaging-materials.html # Semiconductors # Samsung · sipirtu · 1

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