Mmastodon TechnologySemiconductors first seen 1 d ago, last 22 min ago, peak #2
Samsung chairman visits Yokohama lab to explore AI chip packaging
Original: Samsung chairman Lee Jae-yong visited the Advanced Package Lab in Yokohama on November 1 to explore AI chip packaging. S
Samsung chairman Lee Jae-yong toured the Advanced Package Lab in Yokohama, Japan, on November 1, examining advanced chip packaging technology seen as key to the AI semiconductor boom. The visit underscores Samsung's interest in deepening ties with Japan's chip materials and equipment ecosystem as competition in AI chip supply chains intensifies.
Why now: Samsung is under pressure to catch up in the AI chip race, so its chairman's courtship of Japanese packaging expertise draws attention.
SamsungLee Jae-yongYokohamaJapan
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