Mmastodon TechnologySemiconductors first seen 1 d ago, last 23 h ago, peak #3
GlobalFoundries to make TSMC interposers in the US under $2 billion deal
Original: GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion htt
GlobalFoundries has signed a five-year, $2 billion agreement with TSMC to produce silicon interposers for TSMC's CoWoS advanced packaging technology at its US facilities. The deal strengthens the US semiconductor supply chain by bringing a key packaging capacity onshore at a time when demand for AI chips is straining CoWoS capacity worldwide.
Why now: The agreement addresses the industry-wide CoWoS packaging bottleneck for AI chips and reflects growing momentum to onshore semiconductor manufacturing in the US.
GlobalFoundriesTSMCCoWoSUnited States
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- GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion https:// fed.brid.gy/r/https://www.toms… · tomshardware.com@web.brid.gy
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