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- 1GlobalFoundries to make TSMC interposers in the US under $2 billion deal●GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US — Five-year agreement valued at $2 billion htt
GlobalFoundries has signed a five-year, $2 billion agreement with TSMC to produce silicon interposers for TSMC's CoWoS advanced packaging technology at its US facilities. The deal strengthens the US semiconductor supply chain by bringing a key packaging capacity onshore at a time when demand for AI chips is straining CoWoS capacity worldwide.