✉news TechnologySemiconductors first seen 11 h ago, last 4 h ago, peak #12
US could soon develop new EUV materials for denser chips
Original: US could soon develop new EUV lithography materials to enable fabrication of higher-density chips
The US may soon develop new extreme ultraviolet (EUV) lithography materials that would allow semiconductor manufacturers to fabricate chips with higher component density, according to a report by Interesting Engineering. The advance would support continued miniaturization in chipmaking, a field currently dominated by Dutch firm ASML, which supplies the EUV machines used to produce leading-edge processors.
Why now: Chips and semiconductor supply chains are a major strategic and industrial policy concern, so any US advance in leading-edge chipmaking materials draws attention.
United StatesASMLInteresting Engineeringsemiconductor industry
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- US could soon develop new EUV lithography materials to enable fabrication of higher-density chips · Interesting Engineering
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