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Leaked A20 diagram suggests base iPhone 18 will have compromises

Original: Apple’s A20 Solder Joint Diagram Leak Shows The Base iPhone 18 Will Arrive With Multiple Compromises, Such As Inferior Packaging And A Lower GPU Core Count

A leaked diagram of Apple's A20 chip solder joint design indicates the base iPhone 18 will ship with several trade-offs, including inferior packaging and a reduced GPU core count compared with higher-end models. The leak suggests Apple may differentiate the standard model more sharply from Pro variants, reserving advanced packaging and fuller graphics configurations for premium versions of the lineup.

Why now: Fresh leak about next year's iPhone chip specs fuels speculation about Apple's product tiering strategy

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Evidence

• Apple’s A20 Solder Joint Diagram Leak Shows The Base iPhone 18 Will Arrive With Multiple Compromises, Such As Inferior Packaging And A Lower GPU Core Count · Wccftech

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