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Samsung chairman visits Japan unit to highlight chip packaging

Original: Samsung chairman highlights chip packaging, visits Japanese unit

Samsung Electronics chairman Lee Jae-yong visited the company's Japanese operations and stressed the importance of advanced chip packaging technology. The trip underscores Samsung's push to strengthen its position in next-generation semiconductor manufacturing amid intensifying global competition. Advanced packaging has become a key battleground as demand grows for AI and high-performance chips, with Japan a crucial partner for materials and equipment.

Why now: Chip packaging has become strategically critical as Samsung competes with rivals in the AI semiconductor race.

Samsung ElectronicsLee Jae-yongJapan

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Evidence

• Samsung chairman highlights chip packaging, visits Japanese unit · The Korea Times
• Samsung chairman highlights chip packaging, visits Japanese unit · The Korea Times

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