✉news TechnologySemiconductors first seen 4 h ago, last 3 h ago, peak #29
Samsung and SK Join the Co-Packaged Optics Race for AI Chips
Original: [ChipTalk] AI Semiconductors Now Compete at the Speed of Light...Samsung and SK Join the CPO Race
Korean chip giants Samsung Electronics and SK Hynix are moving into co-packaged optics (CPO) technology, which links AI semiconductors using optical connections to boost data transfer speeds and energy efficiency. As AI computing demand surges, Korean media describe the shift as a new race in which chips compete 'at the speed of light', alongside global players developing similar interconnect solutions.
Why now: CPO is emerging as a key next-generation interconnect technology for AI chips, and Samsung and SK's entry signals escalating competition among memory and chipmakers.
Samsung ElectronicsSK HynixCPO technology
Evidence
- [ChipTalk] AI Semiconductors Now Compete at the Speed of Light...Samsung and SK Join the CPO Race · 아시아경제
API: https://socialmediatrends-api.osmike.com/v1/trends/41657