✉news TechnologySemiconductors first seen 2 d ago, last 1 d ago, peak #11
SK hynix reportedly planning mass production of iHBM memory chips
Original: SK hynix Starts Discussing Mass Production Plans For iHBM Memory Chips That Aim To Improve Heat Resistance By 30%, Says Report
SK hynix has reportedly begun discussing mass production plans for its iHBM memory chips, a next-generation memory technology said to offer 30% better heat resistance than current solutions. The development matters for AI and data centre hardware, where thermal management of high-bandwidth memory is a growing bottleneck, though details on timelines and customers remain undisclosed.
Why now: Thermal limits of high-bandwidth memory are a key constraint on AI chips, so improved heat resistance is significant for the industry.
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