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Advanced Substrate Technologies
Trends
- 1KERI develops direct carbon coating technology for substrates●[Science Bulletin] KERI develops direct carbon coating technology for substrates
The Korea Electrotechnology Research Institute (KERI) has developed a technology for directly coating carbon onto substrates, according to a report by DongA Science. The technique could simplify manufacturing processes that currently rely on more complex carbon deposition methods, with potential applications in electronics and energy materials.
- 2Broadcom-Toppan venture opens Singapore's first high-end FC-BGA substrate plant●Advanced Substrate Technologies, a joint venture of Broadcom and Toppan Holdings, opened Singapore's first high-end FC-B
Advanced Substrate Technologies, a joint venture between Broadcom and Toppan Holdings, has opened Singapore's first plant producing high-end FC-BGA substrates, key packaging materials for advanced chips. The facility strengthens Singapore's role in the semiconductor supply chain and adds capacity at a time of surging demand for AI and high-performance computing hardware.