Samsung

Samsung is expected to more than double production of its HBM4 and HBM4E high-bandwidth memory DRAM next year, according to a report citing industry sources. The move reflects surging demand for advanced memory used in AI accelerators, and would tighten the race with SK Hynix, the current leader in high-bandwidth memory supply to chipmakers like Nvidia.

Alibaba has launched Qwen Intelligence as a full-stack agentic AI platform designed for smartphones. The move positions Alibaba's Qwen models to power on-device AI agents capable of handling tasks across apps, intensifying competition in the mobile AI space with rivals like Apple, Google and Samsung.

Korean chip giants Samsung Electronics and SK Hynix are moving into co-packaged optics (CPO) technology, which links AI semiconductors using optical connections to boost data transfer speeds and energy efficiency. As AI computing demand surges, Korean media describe the shift as a new race in which chips compete 'at the speed of light', alongside global players developing similar interconnect solutions.

Jensen Huang has reportedly committed to doubling chip supply, a move that would lock up roughly 37% of the world's high-bandwidth memory (HBM) output for 2026. The pledge underscores Nvidia's aggressive push to secure memory for its AI accelerators amid shortages, leaving rival chipmakers competing for the remaining HBM capacity from suppliers like SK Hynix, Samsung and Micron.

TSMC has reportedly begun pilot production of chips on its A14 node, a 1.4nm-class process, with volume production targeted for 2028. The A14 line would succeed the current 2nm generation and keep the Taiwanese foundry ahead of rivals Samsung and Intel in the race for ever-smaller transistor sizes, with major customers such as Apple expected among early adopters.