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    Samsung and SK Join the Co-Packaged Optics Race for AI Chips▼[ChipTalk] AI Semiconductors Now Compete at the Speed of Light...Samsung and SK Join the CPO Race✉newsTechnologySemiconductors8 h ago

    Korean chip giants Samsung Electronics and SK Hynix are moving into co-packaged optics (CPO) technology, which links AI semiconductors using optical connections to boost data transfer speeds and energy efficiency. As AI computing demand surges, Korean media describe the shift as a new race in which chips compete 'at the speed of light', alongside global players developing similar interconnect solutions.