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- 1Samsung to more than double HBM4 chip outputβSamsung is expected to more than double output of its HBM4 and HBM4E DRAM
Samsung is expected to more than double its output of HBM4 and HBM4E high-bandwidth memory DRAM, according to sources cited by South Korean outlet Sedaily. The expansion signals Samsung's push to scale up next-generation memory supply amid booming demand from AI chipmakers, where it faces intense competition with SK Hynix in the high-bandwidth memory market.
- 2AT&S and the race to build the substrate layer under AI chipsβInside AT&S and the race to make the critical layer beneath AI chips
AT&S, the Austrian circuit-board maker, is drawing attention for its role in producing advanced substrates β the critical layer that connects AI chips to circuit boards. As demand for artificial intelligence hardware surges, chipmakers face a bottleneck in substrate supply, and AT&S is among the companies racing to expand capacity for this often-overlooked component.
- 3US lags in memory chips as tariffs complicate catch-upβAmerica Is Behind on Memory Chips--and Tariffs Threaten to Make Things Harder https://www.wsj.com/tech/ai/america-is-beh
The Wall Street Journal reports that the United States has fallen behind in producing memory chips, a critical component for AI and electronics dominated by Asian manufacturers such as Samsung and SK Hynix. The piece argues that tariffs, intended to bolster domestic industry, could raise costs for US chipmakers and equipment buyers, making efforts to rebuild American memory-chip capacity even harder.
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AMD's market value briefly topped $1 trillion, making it one of the few companies to reach that level as investors bet heavily on its AI chip ambitions. Commentators note the chipmaker is closing the gap with Nvidia, long the dominant beneficiary of the AI semiconductor boom, though AMD's stay in the trillion-dollar club was short-lived.
- 5Broadcom Shares Slide After Earnings Despite Rebound HopesβAVGO Stock Extends Post-Earnings Selloff: Analysts, Retail Expect Strong Rebound
Broadcom stock extended its decline following its latest quarterly earnings report, adding to a post-results selloff. Despite the drop, both Wall Street analysts and retail investors continue to voice confidence that the chipmaker's shares will rebound, pointing to its long-term position in AI semiconductors and networking as reasons to stay bullish on the stock.
- 6Samsung and SK Join the Co-Packaged Optics Race for AI ChipsβΌ[ChipTalk] AI Semiconductors Now Compete at the Speed of Light...Samsung and SK Join the CPO Race
Korean chip giants Samsung Electronics and SK Hynix are moving into co-packaged optics (CPO) technology, which links AI semiconductors using optical connections to boost data transfer speeds and energy efficiency. As AI computing demand surges, Korean media describe the shift as a new race in which chips compete 'at the speed of light', alongside global players developing similar interconnect solutions.
- 7Nvidia's Huang Pledges to Double Chip Supply, Securing 37% of HBMβHuangβs 2x Chip Vow Locks Up 37% of HBM Supply [2026]
Jensen Huang has reportedly committed to doubling chip supply, a move that would lock up roughly 37% of the world's high-bandwidth memory (HBM) output for 2026. The pledge underscores Nvidia's aggressive push to secure memory for its AI accelerators amid shortages, leaving rival chipmakers competing for the remaining HBM capacity from suppliers like SK Hynix, Samsung and Micron.